BARCELONA, Spain — Qualcomm MEMS Technologies, Inc., a wholly owned subsidiary of Qualcomm Incorporated (Nasdaq: QCOM), and Qingdao Hisense Communication Co., Ltd. (HCC), announced the design specifications of the much anticipated Hisense C108 mobile phone that will become the industry’s first handset with Qualcomm MEMS Technologies’ mirasol™ display.

The product, which will begin shipping in 2008 to China and emerging mobile markets, will be on display Feb. 11-14 at the Mobile World Congress 2008 conference in Qualcomm’s booth, located in Hall 8, Booth B53.

The Hisense C108 mobile phone is a lightweight, low-power, candy-bar style handset that weighs less than a quarter pound (80 grams). The C108, based on Qualcomm’s QSC6010™ chipset, uses the 1.2-inch mirasol display that features a resolution of 130 ppi (128 x 96 pixels). The mirasol display functions as the main display of the phone, showing such things as text messaging, phone book entries, time, date and other important information. The phone also supports multiple languages and has 32 Mb ROM and 8 Mb RAM.

“We are pleased to announce the first mirasol-enabled handset with Hisense,” said Jim Cathey, vice president of business development for Qualcomm MEMS Technologies, Inc. “The mirasol display is a key enabler of the C108 handset’s low-power capabilities, extending consumers’ usage time between charges and allowing them to expand their use of mobile phone services.”

As one of China’s top electronics manufacturers, Hisense has in-depth experience in developing cutting edge technology for international markets such as Europe, the Americas, South Asia and Africa. In addition, Hisense has worked with leading consumer electronics companies such as Sony, Philips, Sharp, HP, LG, Sanyo and Siemens.